To Whom It May Concern: Has anyone had any experience stencil printing adhesive for bottom side chip components in a medium to high volume facility? We are looking at some very large quantities of chip components on the bottom side of the boards and the present dispensing equipment will not be able to keep up with the component placement rate. If so: what is a recommended adhesive formulation? what are some recommended squeegee print speed and pressures? what are associated areas of risk stencil printing adhesive? Thank you for your time and consideration. Regards, Kevin Frasier