We have only had a total of twenty survey responses back to date. Most have been from the UK, one from USA via Technet and one from mainland Europe. If this latest survey is to be of value please take a couple of minutes to respond. SMART GROUP SOLDER PASTE STENCIL QUESTIONNAIRE The SMART Group are investigating solder paste stencil requirements. Your help in this exercise will be greatly appreciated. The questionnaire is a further effort to provide its members and the industry with trends on current production technology. Survey results are available from the SMART Group on Cleaning Alternatives and PCB Solder finishes and costs plus the Stencil Evaluation report and the BGA report. Contact for this other material is Tony Gordon Tel: 01494 4465217. Please complete the survey by marking a cross or filling in the required section details. The final results will be posted on SMART E LINK and on The IPC Technet. 1. Company business: a) Military b) Telecomms c) Computers and peripherals d) Consumer e) Other - please specify: 2. Are you a: a) Original Equipment Manufacturer b) Contract Equipment Manufacturer 3. How many SMT boards do you produce per week? 4. How many different types of PCB do you produce per week? 5. How many of these utilise solder paste? 6. Do you use: a) Mesh screens Yes/No b) Metal mask stencils Yes/No 7. If you use stencils how many different stencils do you have in your library? 8. How many will you obtain in: a) the next six months b) the next 12 months 9. Please advise name of companies who supply you with stencils: a) b) c) 10. Do you have any specific requirements for stencils: a) chemically etched Yes/No b) chemically etched nickel plated Yes/No c) laser cut Yes/No d) Electrofom Yes/No e) other - please specify: 11. Please indicated the materials you require: a) S Steel b) Brass c) Nickel d) Other 12. What is the price you expect to pay for: a) chemically etched b) chemically etched nickel plated c) laser cut d) other type Please state frame type: Frame mounted Framless less 13. What form of data is provided to your supplier for the production of stencils: a) Photographic artwork b) Digital data 14.Are you using or planning to use: a) Tape automated bonding b) Chip on board c) Flip chip d) Ball Grid Arrays Thank you for your help in completing this survey. We would appreciate the return of this questionnaire in the next few days. The SMART Group will be publishing the results from this survey on IPC Technet, the Group's own SMART-E-Link Internet Forum and in Surface Mount & Soldering Technology magazine. Bob Willis SMART Group Vice President *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************