TechNet, As a result of what appears to be delamination during the assembly process I have made a comparison between my copy of IPC-A-600, Rev. E, 1995 and IPC-A-610, Rev. B, Amendment 1, 1996 and I would like to here further arguments between the acceptable Pink Ring as pictured on page 19 of my IPC-600 and the unacceptable delamination pictured on page 82, figure 8-11, of my IPC-610. If Pink Ring is evidence of bond separation, how can this be acceptable at the fab level and then unacceptable at the assembly level? Please comment. Thank you. [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************