I have a backplane customer who is pushing signal speeds into far horizon. (800 Mhz - 1 Ghz) We have looked into thermalset resins that will help accomplish this. One of the possibilities was on Cyanate Ester. After inquiring into assembly, we had some negative feedback that the CE would fracture greatly around the press fit pins. I know that CE is (in fact) more brittle than epoxy but so is polyimide. Has anyone out there had experience with press fit pins and CE PWA's? Groovy