I have a backplane customer who is pushing signal speeds into far 
     horizon. (800 Mhz - 1 Ghz) We have looked into thermalset resins
     that will help accomplish this. One of the possibilities was on 
     Cyanate Ester. After inquiring into assembly, we had some negative
     feedback that the CE would fracture greatly around the press fit
     pins. I know that CE is (in fact) more brittle than epoxy but so
     is polyimide. Has anyone out there had experience with press fit
     pins and CE PWA's?
     
     
     
     Groovy