Have just come on technet and saw partial on this. I did some work on this and
can pass material and processing details if the subject is still open. It can be
relatively simple.

Mike Fenner
BSP 
---------------------------------------------
On 23 August 1996 Duglas Stewart wrote
SUBJECT:    re-filling vias with RESIN
REFERENCE:  question previously

I believe someone was looking for a way to completely fill vias  with RESIN (not
the sequential blind via type)

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************