Have just come on technet and saw partial on this. I did some work on this and can pass material and processing details if the subject is still open. It can be relatively simple. Mike Fenner BSP --------------------------------------------- On 23 August 1996 Duglas Stewart wrote SUBJECT: re-filling vias with RESIN REFERENCE: question previously I believe someone was looking for a way to completely fill vias with RESIN (not the sequential blind via type) *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************