An important part of surface mount assembly process control is making sure the proper amount of solder paste is deposited on the pads. The amount deposited varies due to many factors. A few of these issues are: The PCB, the printing parameters, and the paste characteristics. Also, the amount of paste required to make a solder joint which meets ANSI/J-STD-001 varies from pad to pad because of many other issues like: lead coplanarity, amount of solder on the pad from HASL, placement accuracy, reflow conditions,........... I am interested in whether there is an industry standard or how others have calculated the minimum and maximum volumes of paste required. I would appreciate any comments on this subject. Bill Barthel Electronic Assembly Corporation [log in to unmask] (414) 751-3651