There is a growing number of Board Fabricators offering microvias. Most of the microvia processes (SLC, laser, Dycostrate, etc.) are capable of plating shut a via placed in a surface mount pad. The vias are in the .002" to .005" diameter range before plating. The microvia processes are used to plate blind vias from layers 1 to 2 and layers n to n-1. These processes give you space to fan out from dense surface mount packages by putting the via in the pads and then using the routing room on layers 2 and n-1. If you would like more information give me a call. Darren Hitchcock (503) 359-2658 [log in to unmask] [log in to unmask] Wrote: | | I need to know who is providing copper filled via | holes for via hole in | surface mount pad design.... Thanx in advance for help..... *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************