I am in the process of upgrading SPC techniques to our facility. Was wondering if anyone would have any ideas on how to improve, measure and implement SPC techniques to the placement and reflow processes. I did a lot of study on the printing process and I think with proper measurements of solder paste volume and stencil openings - problems like insufficient and bridging can be solved. Your ideas, comments, advise on placement and reflow processes would be much appreciated. Thank-you Mohit Gujral QA Engineer Solectron Ph 408 957 2757 Fx 408 957 2645 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************