We are beginning to see more PCB suppliers offering matte finish LPI.  We 
have heard that this finish reduces the adherence of solderballs.  Is this 
true?  If so, at which process, reflow or wave?  What is the science behind 
this lessening of solderballs?

2nd Question: We are also starting a project that will require conformal 
coating. Is there a preference in solder mask type/finish? The coatings we 
are leaning towards are silicone-based.

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