I am working with a high-temp (> +175degC) soldering process which requires that the plating and or coatings be removed/stripped from component leads. This leaves the base metal (copper) exposed and then we "tin" using production solder (high Pb-based alloy) to within one lead diameter of the component body. (Don't want to expose the component body to the molten solder within the solder pot due to thermal shock and/or fatigue to component). Here's the question: 1) What effects (corrosion, etc.) would we see if we left the component lead base metal (copper) exposed at extended high temp with the potential of moisture present ? Any papers, and or technical resources avalibale that may address this issue ? Thanks, D.Drake *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************