We have a vendor who asked us to forward this inquiry to technet: A customer had a board that accidentally got left in an oven for 7 days at 200F over the 4th of July shutdown. This board is a multilayer board with IR fused solder finish. The board was then wave soldered and the solder flaked off the pads leaving unsolderable copper surfaces. Another board from the extended bake failed all adhesion testing prior to solder. Boards without the extended bake passed adehsion testing. The copper surface on the extended bake boards was dark brown (similar to too much heat) to a white haze. They are trying to explain what happened and have looked for intermetallic and are planning on using auger to look for possible surface contaminants. Has anyone had a similar experience or insight for further evaluation? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************