======== Original Message ======== Sender: [log in to unmask] Received: from simon.ipc.org (IPC.ORG [168.113.24.64]) by dub-img-2.compuserve.com (8.6.10/5.950515) id NAA02086; Mon, 12 Aug 1996 13:25:09 -0400 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id MAA00610; Mon, 12 Aug 1996 12:21:23 -0700 Resent-Date: Mon, 12 Aug 1996 12:21:23 -0700 Received: by ipc.org (Smail3.1.28.1 #2) id m0uq0Jx-0000MqC; Mon, 12 Aug 96 11:58 CDT Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> Mime-Version: 1.0 Date: Mon, 12 Aug 1996 11:47:09 -0400 Message-Id: <[log in to unmask]> From: [log in to unmask] Subject: Min. line width and spacing To: [log in to unmask] Content-Type: text/plain; charset=US-ASCII Content-Transfer-Encoding: 7bit Content-Description: cc:Mail note part Resent-Message-ID: <"n8CLJ.0.W_7.pAs3o"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/5702 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] TechNet's, What is currently the tightest line width and spacing which can be done in high volume? What is the cost impact, if any, of going from 5/5 to 4/4 or 4/3 on a 4 layer, .020-.025 board in selected areas? What board processing steps are most affected? Are there ways of minimizing the impact? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** ======== Fwd by: Tony King / N ======== Image and etching are the two processes most effected by the tight line and space technology, though spacing is much more critical than line width to the manufacturer. The best improvement to minimize the processing problems is to minimize the locations where spacing is reduced. In reviewing many customer designs, I believe minimum space is programmed into the design software and then used everywhere by that software. Tight spacing may not be needed in 50%-75% of the design, but the program faithfully maintains this spacing anyway. The design therefore becomes much more difficult than necessary. Manufacturers may have 4 mil capability for example, but success will be much greater if the locations for problems are reduced. Cost will obviously be based on the difficulty level of the design. The key to manufacturing is DFM, design for manufacture ability. Use the extremely tight features only when/where necessary, not everywhere. Tony King Elexsys International Inc. Nashua N.H. 603-886-0066 [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************