In message <[log in to unmask]> [log in to unmask] writes: > > We have a vendor that is having trouble securing components during a > wave soldering operation(as the board passes over the solder wave). On > DIP through-hole DIP packages they can not clinch the pads due to > trace proximities inherent on the board lay-out. > > Is anybody familiar with methods (fixturing, water-soluble adhesives, > etc,) that can be used for securing components aside from lead > clinching? > > DDrake Perhaps you might consider: 1) Adhesives, good idea. Photocures might be better than heat cure (speed, stress, handling). Suggest you don't think about removal - why not use a permanent one? Cosmetics? 2) There was a thing used in the UK called a VaccuClamp (sp?). This stretched a thin piece of film over the component side of the assembled pcb, which was then "shrink wrapped" - heated to form to the assembly contours. Immediately after wave soldering, whilst still warm, it could be removed easily. It _was_ quite popular, haven't seen one recently. Potential problems: doesn't work with all geometries, static charges, sometimes rips components out during film removal. Some talk of flux fume entrapment during soldering giving problems. Probably worth a shot. I don't know of US supplier, could give you details of a potential UK source. 3) Make a high temperature bean bag and lay it over suspect components to weight them down over the soldering machine. Potential problem: extra weight on a large pcb might contribute to warpage during soldering. Good luck! Peter I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I Peter Swanson Oxfordshire, England INTERTRONICS [log in to unmask] Compuserve: 100120,3641 When you've seen one non-sequitur, the price of tea in China. I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I