Eugenio, As written earlier, I highly recommend Multichip Module Design, Fabrication and Testing from Licari (McGraw Hill, 1800 2624729). Of several literatures and books I have read and put to use, this is sure to teach you the basics on MCMs (Multi Chip Modules). However, the -L is an MCM constructed of Laminates and the -C is constructed of Ceramics. And then you have MCM-Ds which are THIN FILM DEPOSITED, very similar to wafer fabrication. MCMs are used in several package types TAB (Tape Automated bonding) and COB (Chip on Board). Regards, John Gulley - Process Engr Compuroute Inc. Dallas, TX > From: [log in to unmask] > Date: Wed, 7 Aug 96 09:33:05 EDT > To: [log in to unmask], [log in to unmask] > Subject: Re: GEN: Electronic Component Packaging Specs. > Eugenio, > > MCM stands for Multi Chip Module which is a high density packaging and > interconnect approach. the -L and -C stand for the type of substrate. I > believe -L is organic, -C is non-organic. > > IPC-MC-790 Guidelines for MultiChip Module Technology Utilization is a good > place to start. > > Jeff > > *************************************************************************** > * TechNet mail list is provided as a service by IPC using SmartList v3.05 * > *************************************************************************** > * To unsubscribe from this list at any time, send a message to: * > * [log in to unmask] with <subject: unsubscribe> and no text. * > *************************************************************************** > > *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************