You need to verify the footprint of the component! Are they compatabile to IPC-SM-782? Reduce the width of the pads will also help. Of course, the problem can be vendor related. Thanks Michael Yuen ---------- From: TechNet-request To: technet Subject: ASS: Cracking of Decoupling Caps Date: Monday, August 07, 1995 9:26AM I have a mixed technology board - bottom side smt power supply which is failing. I suspect that the failure is due to the unreliability of decoupling ceramic caps. On reworking the caps they tend to crack. I have subjected them to thermal shock tests and they seem to retain their integrity. Any suggestions? Is it a vendor problem (which seems unlikely) only? Thanks in advance. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************