To those interested electroless nickel immersion gold: As we all have seen or read the higher the phosphorous content of the electroless nickel the poorer the solderability. Also keeping the phosphorus content in the low range has some difficulties. In an article in the August 1996 "Plating and Surface Finishing" page 62, a paper from China shows that codeposition of tungsten with electroless nickel produces good solderable electroless nickel and keeps the phosphorous content in the 2 wt% range. The tungsten content is about 4.3 wt% in the deposit and will increase the electrical resistivity of the deposit. The same issue has an article on electrodeposition Pd-Ni alloy deposits that has corrosion resistance, high hardness etc. The article does not so state but I have heard that the solderability of 80Pd-20Ni was very good. Phil Hinton [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************