<<In the previous message I forgot to add that the major benefit in wet lamination is with innerlayer processing for opens and near opens. >> Very good point! Outer layer boards (with through-holes) can be scrapped if the small holes (about 16 mils or less) are dried thoroughly before lamination. The moisture in the holes can create a vacuum in the holes when the board cools, which pulls the dry film into the hole. The dry film can lock-in just inside the knee of the hole & won't be developed out. It then inhibits the pattern plating & causes voids. Matt Byrne *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************