Hello TechNetters! Has anyone had any experience with blind vias in BGA pads? The BGA is a 225 I/O, 1.27mm" pitch. The ball diameter is .0295" and the pad size being considered is .030". The via hole size is .012" maximum. I have had success with vias in pads that go through the board but I'm concerned about using a blind via in the BGA attachment pad due to outgassing or some other unknown problem. Thanks in advance. Harlan [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************