We are having a significant problem with quickturn cards coming in overetched, and we're trying to understand some things about the process of etching. One question that has come up is: Is it possible for etching to be greater in one area of the card over another? If so, how is this possible, and what are the design considerations for this? Some here contend that every feature should etch down by the same nominal amount, say .002 inch, whether the feature is an .008 trace or a large ground plane, since the whole PCB is exposed to etchant at the same time. Is there fault in this thinking? Thanks in advance. Jim Ennis Adtran Inc [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************