What type of HASL process? Vertical or Horizontal? Alternatives....Yes! MANY! e-less Ni IMM Au, OSP, flash gold, Palladium, IMM Silver (and probably many more I've missed) Groovy ______________________________ Reply Separator _________________________________ Subject: FAB: HAL for thin boards? Author: [log in to unmask] at SMTPLINK-HADCO Date: 7/21/96 7:12 PM I work for a PCBA subcon in the Philippines, and we are currently = developing a project that would require using a very thin PCB. I would = like to know the limitations of the HAL process, what minimum PCB = thickness (FR4) can it handle? Is there any low-cost alternative process = (other than bare copper) for surface treatment of such boards? Any help = would be greatly appreciated. -- Luke Mendoza Electronic Assemblies, Inc. http://www.globe.com.ph/~eai *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************