Reply to: RE>>FWD>RE>ASSY revision J-STD- Jeff, The concern I would have about soldering directly to a chip components electrical terminal is the bond strength of the electrical termination to the ceramic. In my experience, I've observed quite a variation in bond strength (tensile and clevage forces) between the metallizations and ceramic. If the stress/strains can be eliminated/controlled, then I don't see any reason not to do a direct component attach to a suitable area on the surface of the printed board. I wouldn't recommend doing the component attach to a solder resist over conductors because (IMO) solder resist shouldn't be used as a primary dielectric --- too many process variables. IMO, it can/could be done --- go for it. Ralph -------------------------------------- Date: 7/18/96 9:11 AM To: Ralph Hersey From: [log in to unmask] Ralph, Your modification illustration assumes surface copper lands from which the addedcomponent must be isolated. For small chip components and a little bit of open real estate, what are your thoughts on bonding the component directly to the "main" pwb and then soldering the jumper wires to the component terminations? Jeff ------------snip/snipped it all -------------------- *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************