I would concur that TM 2.4.36 has temperatures that are well below the accepted use temperatures currently in general use. On a normal double sided boards we normally recommend temperatures of 600-650 degrees F. Thermal planes may require a slightly higher temperature - up to around 700 - 725). IMHO, all that this test will demonstrate if followed to the letter (note para. 5.1.6) is a very poor PTH and not much else. As far as testing how robust a board might be, I don't think that this test goes nearly far enough. In the "real world" the operator is going to contact the terminal land and is likely to apply pressure as well. -- ------------------------------------------------- David E. Robertson Corporate Training Administrator PACE Incorporated -- e-Mail: [log in to unmask] URL http://www.pace-solder.com/info/ ------------------------------------------------- OR -- ------------------------------------------------- David E. Robertson e-Mail: [log in to unmask] URL http://www.clark.net/pub/drbtson/ PACE Incorporated -- e-Mail: [log in to unmask] URL http://www.pace-solder.com/info/ ------------------------------------------------- Message forwarded from PC SprintMail for Windows: Posted: Mon, Jul 15, 1996 11:53 AM EDT Msg: VVJG-5348-2802/20 From: ("RFC-822": <TechNet-request(a)ipc.org>, SITE:INTERNET) Subj: ASSY: Rework Simulation Test RFC-822-Headers: Resent-Date: Mon, 15 Jul 1996 10:48:34 -0700 Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> MIME-version: 1.0 X-Mailer: Novell GroupWise 4.1 Content-type: text/plain; CHARSET=US-ASCII Content-disposition: inline Content-transfer-encoding: 7BIT Resent-Message-ID: <"E942l2.0.TMK.A2cwn"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/5201 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] IPC-TM-650 Method 2.4.36 Rework Simulation, Plated Through Hole calls for unsoldering and resoldering a wire in a plated through hole 5 tiimes using a 60 w. soldering iron set at 450 to 500 deg. F. This soldering iron temperature requirement seems very low to me and doesn't fit actual practice in industry. Is there something I'm missing? Does anyone know why the temperature is required to be at 450 to 500 F? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************