Solderquick have designed a BGA re-balling kit which consists of a paper based carrier holding the new solder balls. This is attached to the PBGA to be re-balled with a clip type fixture, and then reflowed to attach the new balls to the device. The carrier is then softened by moistening it, and then removed. The kits can be obtained from Winslow Automation Inc, Santa Clara at fax (408) 496-0381 attention Jennifer Cortez. Lothar Thole Senior Manager - Technical Operations QPSX Communications Pty Ltd 33 Richardson Street West Perth WA 6005 Australia Tel: +61-9-262-2000 Fax: +61-9-324-1642 email: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************