To: IPC; PCBFab From: Lee-CTUA065 Bab-Hui on Mon, Jul 15, 1996 8:29 AM Subject: %P in electroless Ni Hello, This question is directed to all who are using electroless Ni/immersion gold as PCB surface finish for solderability application. Anyone has done any study on the effect of %P content in the electroless Ni deposits on the solderability & bonding strength as far as assembly is concerned? What is the recommended range of %w/w P content? What is the "dangerous" level? Hope somebody can shed some light on this issue. Regards, B.H.Lee Process Engineer Motorola Electronics Pte Ltd Printed Circuit Board Operations 76, Pioneer Road Singapore 639577 Republic of Singapore Fax: ++65-8630233 e-mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************