Date : 11/7/96 10:29 Msg From: S V C PATRO We have the following querries regarding the rework of BGA: 1. During removal of PBGA package having euctetic solder balls (dia 0.6 to 0.9mm) with 63/37 composition, what happens to the shape and size of the solder ball. 2. Can the removed pbga be again soldered on the PCB. If yes, suggest the rework steps. 3. what standof has to be maintained for assembled PBGA package? 4. Also guide us to which inspection criteria/ standard is to be folloewed. 5. In case of X-ray inspection, is transmission X-ray capable of deflecting the solder defects (specially voids, and insufficient solder)? If yes, what range of X-ray voltages to be applied for multilayer PBGAs. what specification is to be followed? Thanks in advance Regards, S V C patro Altos India ltd Gurgaon, India India *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************