Are you refering to mask adhesion over immersion gold or are you interested in mask adhesion, when using the mask over bare cu, as a plating resist in the immersion gold process? Bob Metcalf Director Solder Mask Systems Morton Electronic Materials >>> <[log in to unmask]> 07/10/96 09:23am >>> From: Stephen Ayotte \\\\\\\EM Quality Engineering \\\\\\\Bldg. 14-3 Col F5 5-1537 Subject: PC Fab We are trying to find out what the industry standards or techniques are for testing solder mask adhesion to immersion gold. We have tried a variety of solder mask systems and have checked the cure using DSC. Please respond with any specification, military, IPC, ANSI or otherwise. Or if anyone has some test they are using that is not listed in another specification that would be appreciated too. We are seeing minor adhesion loss of the solder mask to the metallurgy and are also wondering if some amount is acceptable? **** IBM MD Product Quality Engineer**** **** OEM Quality Engineer **** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************