Item Subject: cc:Mail Text Hi For QFPs, the positional tolerance of the leads (of bent lead specification) is calculated based on the deviation of the Max Matl Condition (MMC) of the leads from the center line of the solder-pad. Does anyone know how the positional tolerance for the solder balls are calculated ? We are trying to set up a specification for the solder-ball inspection. Is there a method specified under JEDEC, EIA, EIAJ, IPC ... etc that we can reference to ? regards Jeff-MH Tan [log in to unmask]