A little more information is needed to reply to this message. When you send out the board is it still in panel form? If not, some hot air leveling machines clamp on to the board and if the pads are under the clamp they can get stuck and ripped off especially if the solder solidifies before the clap is removed. ---------- From: [log in to unmask] To: [log in to unmask] Subject: Lifted pads from HAL Date: Friday, June 28, 1996 1:16PM Dear Technetters We send some of our boards out of plant to be hot air leveled. When we receive the boards back we have noticed a very small number of the boards have isolated surface mount pads that are missing. There is no visible damage to the surface of the board surrounding the area where the pad was.The surface of the board under the surface mount pad looks rough like the pad was pulled off the base laminate. There is evidence that mechanical force was exerted sufficient to break fibers and remove some of the glass epoxy with the pad. We are only seeing 1 or 2 pads on a panel which seem to be in the same general area, however we don't have enough observations to draw any conclusions. Has anyone seen this condition? What could the possible cause be?