Well I am sorry that you could not contact me directly but here is the information on the video tapes, poster sets and all that good stuff. Also you may be interested that I now have a Home Page which covers all the material plus it provides new FAQs on BGA, Reflow Soldeing and Temperature Profiling and thats not all. If you need in-house training the standard courses are all covered on the Home Page. Finally i will be conducting two workshops and one PAC at Nepcon West so see you at the show in the BIG ROOM. Bob Willis Electronic Presentation Services 2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England. Tel: (44) 01245 351502 Fax: (44) 01245 496123 Home Page: http://ourworld.compuserve.com/homepages/bwillis Introduction to BGA Technology Duration: 55 minutes Component types Design requirements Screen print and reflow process Inspection and quality control Rework and repair Process problems and solutions Wave Soldering Process Control Duration: 28 minutes Wave soldering process Soldering materials Process parameters Setting process parameters Quality control checks Common soldering defects Guide to Solder Paste & Screen Printing Duration: 55 minutes Solder paste selection Screens and stencils Practical machine setting Solder paste thickness measurement Quality control standards Common screen printing defects Wave Solder Defect Monitoring Duration: 25 mins + spreadsheet Wave solder introduction Solder yield calculation Manual & automatic charts Practical examples Wave solder defect types Wave Solder Machine Operation/Maintenance Duration: 45 minutes Guide to wave soldering Operation of equipment Maintenance of: fluxer solder pumps pre-heat solder wave conveyor fingers Health & safety Maintenance procedures Surface Mount Rework & Repair Duration: 37 minutes Removal/replacement of components Adhesive removal Solder short removal Fine pitch repair Common repair defects Health & safety Solderability Testing SMT Components Duration: 26 minutes Solderability theory Component storage conditions Manual and automatic testing Solderability criteria Common solderability defects De-Soldering Conventional Components Duration: 24 minutes De-Soldering theory Equipment operation Component removal Component replacement Maintenance of equipment Hand soldering PCB Outgassing Test Kit Duration: 10 mins + test procedures Introduction to blow holes/pin holes Reliability of solder voids Non-destructive test method Practical testing procedure Accept and reject test examples Reflow Soldering & Temperature Profiling Duration: 30 minutes Surface mount assembly Reflow soldering theory Vapour phase Infra-red soldering Convection reflow Hands-on temp. profiling methods Common reflow soldering defects Introduction to Conventional Assembly Duration: 40 minutes Design Rules Components Printed Boards Component Pre Forming Manual Assembly Automatic Assembly Static Control Hand Soldering Wave Soldering Cleaning Inspection Rework Soldering Defects European Inspection & Quality Standards Duration: 30 minutes Criteria for: screen printing component placement conventional solder joints chip components J-leads gull wing terminations wire terminations Common SMT soldering defects Guide to Basic PCB Manufacture Duration: 22 minutes Laminates Drilling operations Plating Solder resists Solder finishes Panel routing Microsection examples Static Control in Electronics Duration: 30 minutes Static generation Component damage Use of: wrist straps heel straps conductive bags work benches work coats trap testers Static control standards Introduction to Inert Soldering Duration: 45 minutes modern assembly processes inert gas advantages benefits of nitrogen soldering inert reflow/wave soldering nitrogen gas supply cost justification Colin Lea/Chris Tanner interviews SMT/Conventional Design for Manufacture Duration: 55 minutes Component selection Component packaging Solder resist types and solderable finishes Hole sizes and pad sizes Component positioning Break out points Fiducial marks and tooling Laminate materials Stencil requirements Introduction to Contamination Testing Duration: 40 minutes Modern assembly techniques International specifications Printed circuit board failures Ionic contamination measurement Surface insulation resistance measurement Introduction to X-Ray Inspection of BGA and Fine Pitch Joints Duration: 35 minutes Criteria for: component placement BGA joints chip components J-leads gull wing terminations Common SMT soldering defects Test sheets for operator assessment Introduction to Surface Mount Technology Duration: 45 minutes Component types Component packaging Design rules Solder paste printing Adhesive application Reflow/wave soldering Inspection Rework and repair Cleaning Soldering defects QUALITY CONTROL & TRAINING WALL CHARTS Basic Printed Circuit Board Manufacture - a basic step by step guide to the manufacture of double sided/multi-layer printed circuit boards Wave Soldering Defect Guide includes common wave soldering defects and their possible causes including blowholes, shorts, skips and balling Conventional Soldering Standards includes accept/reject criteria for lead length, lead clench angle, single sided and double sided solder joints Printed Circuit Board Manufacturing Defects - examples of defects including resist lift, outgassing, delamination, solder balling and possible causes Surface Mount Soldering Standards - criteria for solder paste, adhesive, component placement and solder joint standards for all terminations Conventional Wire Termination Standards includes accept/reject criteria for wire preparation, termination and solder joint assessment Surface Mount Assembly Defect Guide illustrates process defects at screen print, adhesive dispense, placement, soldering and cleaning stages Surface Mount Component Recognition - photographs of the most common surface mount component types and their packaging PCB Microsection Reference Charts - photo micrographs of satisfactory through hole and circuit plating and many common manufacturing faults Ball Grid Array Soldering Guide - X-Ray inspection guide of satisfactory BGA solder joints and process defects Please send your order together with your sterling cheque drawn on a UK bank for L45 pounds sterling + VAT in Europe to EPS. If you require information on EPS' other training services please contact Bob Willis Electroinc Presentation Services 2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England. Tel: (44) 01245 351502 Fax: (44) 01245 496123 Home Page: http://ourworld.compuserve.com/homepages/bwillis