Hey folks, Ok, we all know that certain surface mount components are moisture sensitive. This means that they may suffer damage during reflow soldering conditions due to moisture expansion. We are currently attempting to develop a company policy regarding these little beasties, but are having some difficulty. The problem is compounded by the fact that no one packaging standard is followed universally. We have component bags come in with everything from simple moisture warning labels to labels with specific instructions about humidity and temperature exposure -- anything but the IPC's recommended 1-6 classification. So my question is this: how are other companies handling these components? Also if you're using Vidmar type cabinets, please specify what gas you're using to keep them dry (I'm trying to determine if dry compressed air is adequate). Thanks! Dirk Bellamy Manufacturing Engineer Current Electronics