We are a circuit board surface finishing services provider in Austin, TX. We currently are running a high volume part number for a customer through our hot air solder leveling line. The part is in large panel format and the design dictates that the gold edge connectors are plated before solder leveling step. Their are 60 pcs. per panels that we are covering with a Furon/CHR C690 tape. We roll the tape in a DuPont HRL-24 resist laminator with the rolls are room temp. The panels are detaped after solder leveling and the tape leaves behind quite allot of residue. We have tried residue free tapes, but they won't hold up to the horizontal leveling process. We are hand cleaning the residue with a terpene based solvent made by MicroCare. The process is operator dependent and we are getting scrap escapes to the customer due to the residue. Can anyone offer any suggestions to assist in solving this problem such as a good sprayable aqueous cleaner, a better "residue free" tape, or a good screenable, peelable solder mask process? Any suggestions would be extremely appreciated. Michael Holan Process Engineer Radian International, LLC Electronics Div.. ph.: 512/310-4209 fax: 512/288-0898 e-mail: [log in to unmask]