Date : 22/6/96 10:54 Msg From: ATUL RASTOGI We are evaluating the possibility of using pallets for the assembly of PCMCIA and Flex Circuit boards.These assemblies have to undergo complete SMT process from Paste print to reflow on these pallets. Can anyone there suggest us what kind of material to be used for these pallets which can give necessary coplanarity required for Paste print application and can withstand high temperatures in Reflow and where this material can be available. Thanks in advance Atul Rastogi Altos India Ltd Altos India Ltd