no. It has been my experience that OSP can not handle a prebake at say 225 degrees F for 6 hours. ---------- From: TechNet-request To: TechNet Subject: Assembly - OSP? Clarification. Date: Thursday, June 20, 1996 3:07PM Concerning my original question about the possible degradation of OSP when baking a Thermount or any board prior to wave. 1) What's the problem with Thermount, or what could happen if you don't bake? Due the the hydrophillic nature of the stuff it delaminates when not dehydrated...remember measles?...muliply them. 2) So, my question is really not about OSPs handling multiple reflows but OSPs handling a pre-bake prior to the wave. That's the crux of the problem. Can an OSP handle a prebake at say 225 degress F for 6 hours? Thank you for all your responses. (I do appreciate this meduim, thank you IPC!)