Are you talking about primary image or solder mask? ______________________________ Reply Separator _________________________________ Subject: FAB: photoresist adhesion - testing and process control Author: [log in to unmask] at corp Date: 6/19/96 8:32 AM Last month there were some brief discussions of resist adhesion. Using ASTM D3359-87(a cross-hatch test) was suggested. My questions are: 1) is anyone using such a test for testing acceptance of laminated photoresist? 2) is anyone using such a test for process control in lamination or exposure or developing of photoresist? 3) what defects can appear if adhesion is too low? 4) what defects can appear if adhesion is too high? I would like to discuss these with any interested parties. Lou Hart 412-858-6117 compunetics .