Good Morning - comments to your questions: 2. Has anyone developed workmanship standards more specific to intrusive reflow soldering than those listed in IPC-A-610? **Take a look at IPC JSTD 001 for possible help 3. Most of the components we are planning to use this process on have the leads placed such that it will be difficult or impossible to inspect the solder joint from the screenprinted side of the board, which is where we are hoping to get the good solder fillet. From a practical inspection standpoint, the only thing it looks like we can tell our touch-up operators is that the solder joint should be considered OK if there's solder visible in the hole when inspected from the opposite side of the board. This has us feeling a little uncomfortable ... how are other people handling this? **Hidden solder joints can't be inspected visually and therefore you have two choices: 1) Pray that the process gods are generous and let your process run perfect; 2) Conduct process control and run the process in a proactive mode. I wouldn't bet on #1! I suggest that you focus on the printing operation as a control of the resulting reflowed fillet geometry. The use of xray, Cyberoptics, and/or a destructive coupon test are some methods for setting up and monitoring your process to insure that continuous control is achieved. Bill Barthel at Plexus has a bunch of experience in paste in hole and you might try contacting him for lessons learned (see SMI 94 Proceedings, page 363 for a good paper on the topic of paste in hole by Bill Barthel). 4. Since the solder joints will be difficult to inspect, it becomes ever more important that we control this process up-front. What are the key parameters **Focus on your solder paste stencil operation and fine tune those deposition parameters. Good luck! Dave Hillman Rockwell Collins [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: ASSY:Workmanship Standards For Intrusive Reflow Author: [log in to unmask] at ccmgw1 Date: 6/11/96 5:01 PM Some colleagues have a series of questions about intrusive soldering (paste in hole). Any responses would be greatly appreciated. 1. Regarding workmanship standards for intrusive reflow, We are planning on using IPC (IPC-A-610) workmanship standards, but call the screenprinted side the "secondary side". We would appreciate any comments! 2. Has anyone developed workmanship standards more specific to intrusive reflow soldering than those listed in IPC-A-610? 3. Most of the components we are planning to use this process on have the leads placed such that it will be difficult or impossible to inspect the solder joint from the screenprinted side of the board, which is where we are hoping to get the good solder fillet. From a practical inspection standpoint, the only thing it looks like we can tell our touch-up operators is that the solder joint should be considered OK if there's solder visible in the hole when inspected from the opposite side of the board. This has us feeling a little uncomfortable ... how are other people handling this? 4. Since the solder joints will be difficult to inspect, it becomes ever more important that we control this process up-front. What are the key parameters that others have found, specific to intrusive reflow soldering? Thanks in advance