Have seen a number of literature articles indicating the standard material for a MCM-L is BT resin. Question 1: Which laminate material suppliers make BT based resin laminates? Question 2: With the advent of multifunctionals what properties still make BT resin based laminates the preferred choice?. Question 3: Do today's BT resin formulations still show the significant shrink previously reported? Question 4: Are there fabrication issues related to fine lines, feed through holes or lamination that make BT resin based multichip module boards more challenging to the fabricators and thus make them less cost effective when compared to other resin systems of comparable glass transition temperature?