I would like to see IPC's response on this subject because I'm under the assumption that nailheading is no longer a reason for rejection. (I've also been told that somewhere somebody ran tests and found increased holewall adhesion due to the nailheading<increased cu to cu plated sites>)(?????) I would think that only in the case of positive etchback requirements would nailheading really create an issue. Am I correct or wrong in my thinking? Groovy ______________________________ Reply Separator _________________________________ Subject: Nailheading Author: [log in to unmask] Date: 1/31/96 12:19 PM Simple Question: Has anybody found a functional defect in multilayer pwb's due to nailheading??? D.Rooke ([log in to unmask])