The Orange County Chapter of The International Electronics Packaging Society Presents: Flex Circuits, a Panel Disscussion Tuesday, 11 June 1996 AeroJet Electronic Systems 5:30 p.m. - 9:00 p.m. 1100 Hollyvale Azusa, Calif, Cost: $10 The technical program runs from 6:45 P.M. to 9:00 P.M. The need to package electronics in ever smaller volumes is becoming more important for today's designers. The use of flex circuitry provides a significant reduction in system size and weight. In some cases sufficent reduction can be accomplished using flex circuits with conventional technology (thru hole). In higher packaging density situations, flex circuity coupled with the use of ASICS, SMT, chip on board et al, has led the boom in many consumer electronic products. Panelists include: Jerry Price, Senior Engineer, AeroJet - Cryogenic flex designs (10K) Bill Gaines, Senior Engineer, AeroJet - Design for Space Environments/large interconnect Dan Dove, Senior Engineer, Basic Electronics - Fabrication and Assembly/print to assembly, design seminars Murray Chalmers, Pioneer Circuits - Fabrication and Assembly/ military and commercial applications. Please RSVP by Monday 10 June. Aerojet security requires a list prior to the meeting. Non-US Citizens must provide Passport # Voice RSVP to: IEPS OC/LA Chapter Voice Mail: (714) 665-6625 E-mail RSVP may be directed to [log in to unmask] (Bill Gaines, OC-LA IEPS chapter board member) Please direct e-mail questions about the IEPS OC/LA Chapter to: Bill Gaines, <[log in to unmask]> (818) 812-2199 ===================================================================== Information about the IEPS may be obtained via e-mail at ieps.com =====================================================================