I worked with a deep tank Nickel-Gold line many years ago (nickel sulfamate, gold strike, hard gold and soft gold tanks). Our clean line was basically an electroplating clean line, with an acid cleaner, a peroxide-sulfuric microetch, sulfuric acid dip, then the nickel bath. We had a sulfuric dip between the nickel and gold strike. Rinses were tap water, with DI sprays over top (came on only when parts were being removed from the rinse). We went into all the electroplating tanks "live", even the nickel bath I believe. The panels to be plated came from either the copper plating line or from dry film, so there was definitely no scrubbing done. If I had to live with just one tank for a clean line, it would contain an etching cleaner, or at least a micro-etch. Sometimes I think you can do as much harm as good with scrubbing. I also am vehemently opposed to those dryers out there with chamois covered rollers, as I know they can deposit as much as they remove, unless constantly replaced. Hope this helps. Pat Goldman [log in to unmask] ---------- From: TechNet-request To: Technet Subject: FAB: Manual Scrubbing prior to NiAu Date: Thursday, June 06, 1996 10:00AM Address, EXPLANATION: I have been conducting some experiments on the use of mechanical and chemical scrubbing on panels prior to resist lamination. We currently perform a mechanical scrub to all panels prior to resist lamination. Based on minimal testing, we are successful in chemical cleaning panels prior to resist lamination with no resist breakdown in deep electrolytic Ni and Au. However, in the test process we conducted a tape test and discovered NiAu peel from the base copper (no electrolytic copper applied due to reason of test). The NiAu peel from the copper occurs on mechanical scrubbed and chemical clean sample panels, but on different sides. The mechanical scrubbed panel has peel on the component side and the chemical clean panel has peel on the solder side. So the problem now points to the method in which we prepare panels prior to Ni and Au plating. To insure good adhesion between Ni-copper and Au-Ni, panels are manually scrubbed with an abrasive pad. Recent observation shows there is a large variable associated with this type of method. QUESTION: -I would like to discuss with other manufacturers who use deep Ni and Au plating? -What types of methods are others using to prep panels prior to Ni and Au plating? -Is the method chemical or mechanical and if mechanical how are variables minimized? Please advise. Thank you.