YOU ARE CORDIALLY INVITED to attend our 3rd Annual E / T Program on: Wednesday, February 7, 1996 - 5:00 p.m. - 9:00 p.m. Location: Holiday Inn - Maingate, 1850 S. Harbor Blvd. Anaheim, California Cost: $7.00 - RSVP (714) 665-6625 by Tues., February 6, 1996 This program is an excellent opportunity for engineers and other technical personnel in Southern California to evaluate and compare the latest emerging technologies for advanced electronic packaging. "Emerging Technologies 1996" is designed for broad appeal and should be of interest to electrical engineers, electronic packaging engineers, mechanical engineers, software engineers, manufacturing engineers, sales / marketing specialists, and technical managers. Abstracts of Technical Presentation Low Cost, Robust Sensors Based on Advanced Thick Film Technology Speaker: Dr. Boris Kamentser, President, Bokam Engineering, Inc., Santa Ana, California. Dr. Kamentser immigrated to the United States in 1978 and has authored and patents in the flow measurement field in both the United States and in the former U.S.S.R Advances in thick film technology have led to a new approach in the design of sensors and transducers. This approach utilizes a screen-printing process that permits printing of strain gauges directly onto the surface of the sensing element. The result is a stable, robust transducer produced at low cost. Dr. Kamentser will discuss the particulars of thick film technology, the guidelines for the design of the sensing element and signal processing electronics, and temperature compensation metholds. Various applications for the new transducer product line will be reviewed, particularly ones for the automobile industry, computer manufacturing, and jet engine testing. Microelectromechanical Systems (MEMS) and Micromachining Technology" Speaker: Dr. C.J. Kim, Assistant Professor, Mechanical / Aerospace Engineering, UCLA, Los Angeles, Ca. Dr. Kim conducts research activities on MEMS including design and fabrication of microstructures, microactuators and sensors, microthermal and fluid devices, mechanics in microscale, and non-conventional manufacturing. Microelectromechanical Systems (MEMS) have become one of the fastest growing, most visible fields in the world. Evolved from the integrated circuit fabrication community, most of the MEMS devices, which are produced as silicon chips, face unique packaging challenges due to the moving elements on the chips. Dr. Kim will present an overview of micromachining technologies for MEMS, discuss examples of current commercial products using MEMS, and review the on-going MEMS research at UCLA. Monolithic Microwave HEMT-HBT Integrated Circuits" Speaker: Dr. Dwight C. Streit, Technical Fellow, Microelectronic Products & Technology, TRW Space & Electronics Group, R. B., Ca. Dr. Steit is a TRW Technical Fellow and the principal investigator for monolithic HEMT-HBT integrated circuits and for semiconductor materials research and development. High performance GaAs - based microwave circuits have historically used either high electron mobility transistors (HEMTs) or heterojunction bipolar transistors (HBTs), but not both types of transistors in the same integrated circuit. TRW has achieved the successful monolithic integr- ation of HEMTs and HBTs in the same microwave circuit, thus creating an entirely new class of microwave circuits that can achieve functions and performance not currently available using existing single - device technologies. Dr. Streit will discuss the endless design opportunities when both HEMT and HBT are available on the same chip and how monolithic integration of microwave and digital functions can significantly improve receiver performance. Please direct e-mail questions to Bill Gaines, [log in to unmask] ===================================================================== Information about the IEPS may be obtained via e-mail at [log in to unmask] =====================================================================