Any experience out there with processing Getek material? Specifically: - Can positive etchback be achieved with sodium permanganate (i.e., without plasma or chromic)? - Is it compatible with both EDTA and DMAB-based oxides? - How critical is the published "6-9 deg.F uniformly through the press book" heat rise? - How repeatable are raw laminate shrinkage factors? (similar to FR4 or drastic like polyimide) - What post-drill bake, if any, is required prior to etchback? - Any problems with this bake degrading the oxide adhesion? - Any success stories with direct metallization? - Is gassing at desmear & electroless more,less or the same as FR4s. Designers: - What's the driving force for this genre of material? - Is it just Dk and dissipation factor or is there something more? - Is Neltec's N4000-13 (non-PPO mat'l) a true equivalent? - Are there any others? - Is this where the board industry is going? Lots of questions, hoping for some answers. Thanks in advance. J. Felts PC World, Toronto