A question re: board repair. When selectively re-plating a gold edge contact, using a procedure like IPC-R-700 4.2.3.1, a voltage is applied between a cathode and the (anode) plating swab. This voltage varies between 3V and 8V, depending on the plating or cleaning solution to be used. One of our customers has queried the possible damage such voltage might do the the components on his board. My thoughts are that the voltage and current will be confined to the plating area, and will not get to the components. To ensure this, either a) the gold fingers to be selectively plated should be temporarily "bussed" to keep them all at the same potential or b) if a single finger, then all surrounding area should be tape masked to prevent plating solutions and/or accidental voltage getting to it. Has anyone else considered this a potential problem? ((Excuse pun...)) Peter I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I Peter Swanson Oxfordshire, England INTERTRONICS [log in to unmask] Compuserve: 100120,3641 If it weren't for the last minute, nothing would ever get done. I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I