Here are details of some of the latest training material I have been producing in the UK which should be available in June. The defect photo album may be of interest to people wanting to produce there own training material or standards. Bob Willis Surface Mount Process Defect Guide The first CD ROM provides a guide to common process defects found at each stage of the SMT process. It also includes defects specifically on printed boards and components. At the first screen you select the process you want to view which gives you an introduction to the processes listed below. Printed Boards, Components inc; BGA, Screen Print, Adhesive Application, Placement, Reflow Solder, Wave Solder, Cleaning, Rework In the case of printed board section it explains the most important issues with surface mount circuits. It then lists common process defects which can be selected to reveal a photographic example of the defect type and an explanation of the possible causes. This disk will form part of the forthcoming Bob Willis Master Class Series Surface Mount Process Defects Photo Album This CD ROM provides the process or quality engineer with a source of photographs of process defects which may be used in company inspection document or presentations. They may be simply pasted into any document for in house company use. Each photograph is provided as a .Tiff file format The disk includes examples of the following: Chip Leaching, Poor Solderability, Plastic Cracking, BGA Misplacement, BGA Cracking, BGA Cracking, Capacitor Cracking, Plastic Softening, QFP Cracking, Solder Beading, Crystallised Joints, Cracked Joint, Poor Pad Wetting, Component Lift, No Wetting, Joint Failure, Joint Voiding, Solder Wicking, Component Lifting, Solder Short, Non Reflow, PCB Measeling, Poor Penetration, Solder Skip, Bulbous Joint, Blow Hole, Solder Webbing, Adhesive Contamination, Adhesive Stringing, Excess Adhesive, Misplaced Lead, Misplaced Component, Dendrite Growth, Corrosion, Solder Spikes, Flux Residues, Joint Cracking, Pad Lifting. Surface Mount Inspection Standards The CD ROM provides a simple tutorial on inspection of surface mount assemblies. It covers adhesive application, placement and soldering. The four main termination's are covered, chip, gull wing, J Lead and castillation. The criteria is given with each example which is in line with the current European and IPC standards. Also included on the CD ROM is an inspection standard which can be modified or printed out with illustrations for a company training document or inspection standard. Conventional Soldering Standards The CD ROM provides a simple tutorial on inspection of conventional assemblies. It covers lead length, lead clench and soldering of components and wire termination's. Single sided, double sided boards are illustrated. The criteria is given for each example which is in line with the current European and IPC standards. Also included on the CD ROM is a inspection standard which can be modified or printed out with illustrations for a company training document or inspection standard. Bob Willis Electronic Presentation Services 2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England. Tel: (44) 01245 351502 Fax: (44) 01245 496123 Home Page: http://ourworld.compuserve.com/homepages/bwillis Email: [log in to unmask]