Antitarnish???? Do you mean post oxide process?? (Like DMAB?) (Sounds like your microetch was spent or contaminated. Did somebody run double treat through it?) Dave Hoover ______________________________ Reply Separator _________________________________ Subject: Delamination Author: [log in to unmask] at SMTPLINK-HADCO Date: 5/27/96 10:39 AM We have detected a large delamination on all boards from one of our production batches. This delamination appears in the SMT IR oven (short wave) step in our customer facility. Curiously the delamination takes place between black oxide and base copper interface. In other words, the black oxide layer peels away from his own base copper and remain stick on epoxy resin. The stripped Cu appears pink. We suppose that we made a mistake in B.O. process but we don't know where exactly. Our B.O line has de following steps: Sodium persulfat microetching Black oxide (Shipley) Oxide reduction (Shipley) Antitarnish and rinse Hot air drying. Did somebody hear about this kind of delamination?. If yes, which is the B.O. wrong parameter? Excuse my English. thanks in advance. Jos=E9 Muelas