Mail*Link(r) SMTP FWD>FAB: Fwd: Printed Circuit Board Lamination Process Marc and Dean There is a good use to reuse printed board base material. Good quality stuff is ground up and used as a filler by the molded plastics industry. If you want, I can check and find out some more particulars, or perhaps Chris Rhodes (the environmental guy) at IPC headquarters might have some better info. Ralph Hersey e-mail: [log in to unmask] -------------------------------------- Date: 5/22/96 12:54 PM From: Dean R. Cornstubble I am not sure if any of you can address this issue, but TechNet seemed to be a good place for forwarding this message. Date: Tue, 21 May 96 16:39:43 EDT From: List Manager 2 To: [log in to unmask] Subject: Printed Circuit Board Lamination Process Date: Mon, 20 May 1996 15:00:40 -0700 (PDT) From: Marc Siegel <[log in to unmask]> Subject: Printed Circuit Board Lamination Process A Printed Circuit Board company is looking for ways of eliminating, recycling or at least reducing two wastes generated during the lamination process. They are looking for a use for the edge trim which is generated during the process. About 2 million pounds of edge trim are generated at their facilities worldwide each year. The composition of the edge trim (in weight %) is: Continuous Filament Fiber Glass 40-70% Epoxy Resin 30-60% DMF (Dimethyl Formamide) 0.0015% (1500 mg/g) They are also looking for ways of eliminating, regenerating, or recycling the resin mixture left at the end of the process. This resin solution contains a glycidyl ether of brominated bisphenol A, acetone, epoxy resin, dimethyl formamide, phenyl glycidyl ether, amyl alcohol, and epichlorohydrin. Thank you, Marc =================================================================== Dr. Marc H. Siegel Project Coordinator, E-LYNX (US EPA ETI Program) Engineering Process & Information Consulting 12397 Picrus Street San Diego, CA 92129-4113 Phone: 619-484-9855 Fax: 619-484-9856 E-mail: [log in to unmask] =================================================================== Dean R. Cornstubble Research Chemical Engineer Research Triangle Institute (Pollution Prevention Program) Phone: 919-541-6813 (Fax, 7155) http://www.rti.org/units/ese/pp.html ------------------ RFC822 Header Follows ------------------ Received: by quickmail.llnl.gov with SMTP;22 May 1996 12:53:51 -0700 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id OAA01961; Wed, 22 May 1996 14:50:06 -0700 Resent-Date: Wed, 22 May 1996 14:50:06 -0700 Received: by ipc.org (Smail3.1.28.1 #2) id m0uMHgg-0000O8C; Wed, 22 May 96 12:27 CDT Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> Date: Wed, 22 May 1996 13:18:25 -0400 (EDT) From: "Dean R. Cornstubble" <[log in to unmask]> Subject: FAB: Fwd: Printed Circuit Board Lamination Process In-reply-to: <[log in to unmask]> To: [log in to unmask] Message-id: <[log in to unmask]> MIME-version: 1.0 Content-type: text/plain; charset=US-ASCII; X-MAPIextension=".TXT" Content-transfer-encoding: 7bit Priority: Normal References: Conversation <[log in to unmask]> with last message <[log in to unmask]> Resent-Message-ID: <"9E2IC2.0.s7H.Tvqen"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/4278 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask]