Thanks for the mail details about details about my video tapes and the wave solder evaluation board are provided here. Thanks for your interest. Wave Solder Test Board and Evaluation Procedure Bob Willis Electronic Presentation Services 2 Fourth Avenue Chelmsford Essex CM1 4HA England. Tel: (44) 01245 351502 Fax: (44) 01245 496123 Email:[log in to unmask] Introduction The wave solder test board is designed to evaluate the soldering performance of various soldering fluxes under different soldering conditions. The results can then be assessed against previous production trials. The test board also allows solder masks to be assessed to evaluate the rate of solder balling with different flux or varying fabrication or assembly conditions. The soldering performance of alternative Solderable coatings like copper, nickel/gold, silver and tin/lead can also be assessed. The specially designed test board provides repeatable results for any evaluation programmes without the need for components. This significantly reduces the time and cost of any process trials. Guidance on setting up a wave soldering process is also provided together with a recommended method of comparing process results and parameters. When results have been gained for a combination of flux, resist or machine settings then the test board may also be used for process optimisation or continuous process monitoring. The test board design consists of different design features including round solder pads, large earth plains and fine line sections. In each case the features are mounted in different directions to aid process evaluation. The different pad features and sizes are detailed on the accompanying drawing and listed. An example form is provided to allow the collection of data regarding trials using this special board design. As this board becomes used by other companies the results obtained by other users may be available for exchange. The test boards design files are obtained direct from Electronic Presentation Services. The disk may be obtained containing the Gerba design files which may be used to produce your own test boards from your normal circuit board supplier. The standard test board available from EPS features solder mask over bare copper with pad and tracks defined. It is made from FR4 laminate and solder mask coated. An alternative technique for defect data collection is also available as a spreadsheet. This provides an effective method of recording PPM Parts Per Million defects during production. It is provided with a training video so that defect data collection using the spread sheet or manual forms is undertaken correctly. Test Board Sites and Result Sheet Position 1: Solder Ball Count Round Pads 0.050" Position 2: Solder Ball Count Round Pads 0.050" Position 3: Solder Ball Count Round Pads 0.050" Position 4: Solder Shorts Track Width 0.005" Gap 0.008" Position 5: Solder Shorts Track Width 0.005" Gap 0.008" Position 6: Solder Ball Count Round Pads 0.050" Position 7: Solder Ball Count Round Pads 0.022" Position 8: Solder Ball Count Round Pads 0.022" Position 9: Solder Ball Count Round Pads 0.022" Position 10: Solder Ball Count Round Pads 0.050" Position 11: Solder Ball Count Round Pads 0.050" Position 12: Solder Shorts Track Width 0.005" Gap 0.008" Position 13: Solder Shorts Track Width 0.005" Gap 0.008" Position 14: Solder Shorts Track Width 0.005" Gap 0.008" Position 15: Solder Shorts Track Width 0.005" Gap 0.008" Position 16: Solder Shorts Track Width 0.005" Gap 0.008" Position 17: Solder spikes solid copper area Position 18: Solder Shorts Track Width 0.004" Gap 0.006" Position 19: Solder Shorts Track Width 0.004" Gap 0.006" Position 20: Solder Shorts Track Width 0.004" Gap 0.006" Introduction to Inert Soldering Duration: 45 minutes modern assembly processes inert gas advantages benefits of nitrogen soldering inert reflow/wave soldering solder balling nitrogen gas supply cost justification copper finish boards Colin Lea/Chris Tanner/Bob Willis interviews Introduction to BGA Technology Duration: 55 minutes Component types Design requirements Screen print and reflow process Inspection and quality control Rework and repair Process problems and solutions Wave Soldering Process Control Duration: 28 minutes Wave soldering process Soldering materials Process parameters Setting process parameters Quality control checks Common soldering defects Guide to Solder Paste & Screen Printing Duration: 55 minutes Solder paste selection Screens and stencils Practical machine setting Solder paste thickness measurement Quality control standards Common screen printing defects Wave Solder Defect Monitoring Duration: 25 mins + spreadsheet Wave solder introduction Solder yield calculation Manual & automatic charts Practical examples Wave solder defect types Wave Solder Machine Operation/Maintenance Duration: 45 minutes Guide to wave soldering Operation of equipment Maintenance of: fluxer solder pumps pre-heat solder wave conveyor fingers Health & safety Maintenance procedures Surface Mount Rework & Repair Duration: 37 minutes Removal/replacement of components Adhesive removal Solder short removal Fine pitch repair Common repair defects Health & safety Solderability Testing SMT Components Duration: 26 minutes Solderability theory Component storage conditions Manual and automatic testing Solderability criteria Common solderability defects De-Soldering Conventional Components Duration: 24 minutes De-Soldering theory Equipment operation Component removal Component replacement Maintenance of equipment Hand soldering PCB Outgassing Test Kit Duration: 10 mins + test procedures Introduction to blow holes/pin holes Reliability of solder voids Non-destructive test method Practical testing procedure Accept and reject test examples Reflow Soldering & Temperature Profiling Duration: 30 minutes Surface mount assembly Reflow soldering theory Vapour phase Infra-red soldering Convection reflow Hands-on temp. profiling methods Common reflow soldering defects Introduction to Conventional Assembly Duration: 40 minutes Design Rules Components Printed Boards Component Pre Forming Manual Assembly Automatic Assembly Static Control Hand Soldering Wave Soldering Cleaning Inspection Rework Soldering Defects European Inspection & Quality Standards Duration: 30 minutes Criteria for: screen printing component placement conventional solder joints chip components J-leads gull wing terminations wire terminations Common SMT soldering defects Guide to Basic PCB Manufacture Duration: 22 minutes Laminates Drilling operations Plating Solder resists Solder finishes Panel routing Microsection examples Static Control in Electronics Duration: 30 minutes Static generation Component damage Use of: wrist straps heel straps conductive bags work benches work coats trap testers Static control standards SMT/Conventional Design for Manufacture Duration: 55 minutes Component selection Component packaging Solder resist types and solderable finishes Hole sizes and pad sizes Component positioning Break out points Fiducial marks and tooling Laminate materials Stencil requirements Introduction to Contamination Testing Duration: 40 minutes Modern assembly techniques International specifications Printed circuit board failures Ionic contamination measurement Surface insulation resistance measurement Introduction to X-Ray Inspection of BGA and Fine Pitch Joints Duration: 35 minutes Criteria for: component placement BGA joints chip components J-leads gull wing terminations Common SMT soldering defects Test sheets for operator assessment Introduction to Surface Mount Technology Duration: 45 minutes Component types Component packaging Design rules Solder paste printing Adhesive application Reflow/wave soldering Inspection Rework and repair Cleaning Soldering defects QUALITY CONTROL & TRAINING WALL CHARTS Basic Printed Circuit Board Manufacture - a basic step by step guide to the manufacture of double sided/multi-layer printed circuit boards Wave Soldering Defect Guide includes common wave soldering defects and their possible causes including blowholes, shorts, skips and balling Conventional Soldering Standards includes accept/reject criteria for lead length, lead clench angle, single sided and double sided solder joints Printed Circuit Board Manufacturing Defects - examples of defects including resist lift, outgassing, delamination, solder balling and possible causes Surface Mount Soldering Standards - criteria for solder paste, adhesive, component placement and solder joint standards for all terminations Conventional Wire Termination Standards includes accept/reject criteria for wire preparation, termination and solder joint assessment Surface Mount Assembly Defect Guide illustrates process defects at screen print, adhesive dispense, placement, soldering and cleaning stages Surface Mount Component Recognition - photographs of the most common surface mount component types and their packaging PCB Microsection Reference Charts - photo micrographs of satisfactory through hole and circuit plating and many common manufacturing faults Ball Grid Array Soldering Guide - X-Ray inspection guide of satisfactory BGA solder joints and process defects You should also be able to contact the SMTA office in the US for tape information. Joanne Stromberg (612) 920 7682 Contact Electrovert in the US for test board enquires Lisa Oliver (214) 606 1900. Please send your order together with your sterling cheque from a UK bank for L45 pounds sterling + VAT if in Europe to EPS. If you require information on EPS' other training services please contact Bob Willis Electroinc Presentation Services 2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England. Tel: (44) 01245 351502 Fax: (44) 01245 496123 Home Page: http://