We procure microwave boards that to IPC-HF-318 would be Class 3 Type 3. Recently we see some suppliers having problems which result in plating voids. The criteria for voids in a plated through hole are defined but voids in the plated edges of the board do not seem to be defined anywhere. Question 1. A void across an interconnect in a normal multilayer is real bad but what about a void across the same interconnect when it is a ground that goes all the way around the periphery of the finished board? Question 2. Does anybody know where plated edge requirements are listed? Question 3. Since I can not find what I am looking for in a specification, if no specification exists, does anybody have criteria? Thanks [log in to unmask]