Address, I am trying to determine if we are achieving optimum resist adhesion to bare copper after developing. In the past I have performed a soldermask adhesion test using 1/2 inch 600 tape over a 10x10 cut area, per IPC specs. Can this same process be duplicated on resist after developing. I ran some coupon test on some 6x6 samples and performed a tape adhesion test without cutting a 10x10 area. The results were not very promising. Will someone advise if this is an acceptable means of determining resist adhesion over copper. If not, please advise of an approved method, either IPC or MIL standards. Thank you. Regards, John Gulley - [log in to unmask]