To Technet Soldering of mixed technology boards: I have a problem in which the SMDs show random opens at the solder joint after the wave soldering of the components that go into the holes. The SMD solder connections that are most likely to have opens are those which have a short heat path thru the via holes to a land that contacts the solder wave. Suggestions have been: (1) Tent or plug all of the holes that contact the wave except those that have lead in the hole. (2) Use a nitrogen blanket during wave soldering (3) Flood the top side of the board with flux during wave soldering so that any connection that is reflowed does not oxidize and will form a new solder joint. (4) After wave soldering, flood the top side of the board with flux and reflow it. Is there any other solutions, the nitrogen blanket is a long term fix for the assembly shop but not a present fix. Thanking you in advance for any solutions Phil Hinton [log in to unmask]