Are all copper alloy leads and lead frames the same ? Are there material and/or lead process differences (annealing, cold work,etc..)that would make one method of fabricating Cu lead or lead frame more susceptible to dissolution at high temps >+175degC with the soldering alloy being high tin (similar to SN96) ? SOLDERING PROCESS A hand soldering process with soldering iron tips being at or around 850degF with 3 to 5 second dwell. PROBLEM The dissolution of metals appears to be occurring on some Cu leaded parts fairly rapid while on others there appears to be little evidence of this happening. It appears as though the component lead is virtually disappearing. All parts are chemically stripped and pretinned with Sn99 to prevent the possibility of cross-contamination with Pb. The solder joints are under thermal soak @ temps greater than +175degC Any information on this subject would be appreciated. Thanks, D.Drake